You have surely seen the article announcing that the Core Ultra 400 would be twice as large as AMD chips. This mainly comes from leaks around the silicon surface called the die:
- Without its integrated XXL cover (bLLC), a Nova Lake tile would be around 110 mm².
- With bLLC, it would fall around 150 mm².
- By comparison, an AMD Zen 6 CCD with 12 cores would be around ~76 mm², according to the same leaks.
So yes, in terms of physical size, Intel would be large (about ~45% more per tile), but "twice" only works if we compare certain extreme versions with certain AMD configurations. It is therefore exaggerated to say "twice as large in general", especially since AMD could also increase the surface area with its own designs.
One die larger, it can mean more potential power, but also more expensive to produce and a higher risk of defects on the wafer - which has a real economic impact for Intel.


